Thermal Management Materials
Thermal pads
Silicone-free type
COOLPROVIDE™（One side tacky） CPSH-F
Thermal conductivity 5W/m・K, low-hardness (ASKER C 32) thermal pad
COOLPROVIDE™（Both side tacky） CPSH
Thermal conductivity 5W/m・K, low-hardness (ASKER C 32) thermal pad
COOLPROVIDE™（One side tacky） CPVH-F
Thermal conductivity 3W/m・K, low-hardness (ASKER C 15) thermal pad
COOLPROVIDE™（Both side tacky） CPVH
Thermal conductivity 3W/m・K, low-hardness (ASKER C 15) thermal pad
COOLPROVIDE™（One side tacky） CPVP-30-F
Silicone-free, low-hardness, high thermal conductivity (3W/m・K) thermal pad
THERMAL DAMPER（One side adhesive attached） CPAG-T
Thermal pad with vibration damping of loss factor 0.9
CHANGE GEL™（Both side tacky） CGD
Phase changeable thermal pad which softens and increases in adhesive strength at 50℃
CHANGE GEL™（One side tacky） CGDR
Phase changeable thermal pad which softens and increases in adhesive strength at 50℃
GRAPHITE HYBRID SHEET GHS-25
Stacked layers work together to prevent hot spots and returned heat to the device.
HEAT SPREADER SHEET HSD
Thin and flexible heat spreader for thermal management at hot spots in devices
