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Thermal Management Materials

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25 results for products.
Product Description Thickness（mm） Thermal conductivity(Hot Disk method)(W / m・K) Hardness(ASKER C) Hardness(Shore OO)  
SPVS COOLPROVIDE™ SPVS Thermal pad with conductivity 5W/m・K, suitable for electronic devices 0.5/1.0/1.5 3.4 70 86 Product information Catalog
COOLPROVIDE　 CPVG COOLPROVIDE™ CPVG Putty TIM can be applied thickly with a dispenser - 3.0 - - Product information Catalog
SPV COOLPROVIDE™ SPV Thermal pad with conductivity 3W/m・K, suitable for electronic devices 0.5/1.0 2.3 40 69 Product information Catalog
CPSH-F COOLPROVIDE™（One side tacky） CPSH-F Thermal conductivity 5W/m・K, low-hardness (ASKER C 32) thermal pad 0.5/1.0/1.5/2.0/2.5/3.0/3.5/4.0 3.7 32 64 Product information Catalog
GAP PAD GAP PAD GP1 Low-hardness and durable thermal pad, suitable for electronic devices 0.5/1.0/1.5/2.0/2.5/3.2/4.0 - - 25 Product information Catalog
CPSH COOLPROVIDE™（Both side tacky） CPSH Thermal conductivity 5W/m・K, low-hardness (ASKER C 32) thermal pad 1.0/1.5/2.0/2.5/3.0/3.5/4.0 3.7 32 64 Product information Catalog
CPVH-F COOLPROVIDE™（One side tacky） CPVH-F Thermal conductivity 3W/m・K, low-hardness (ASKER C 15) thermal pad 0.5/1.0/1.5/2.0/2.5/3.0/3.5/4.0 2.2 15 47 Product information Catalog
SP SIL PAD SP Durable and flexible thin thermal pad 0.25 - - - Product information Catalog
CPVH COOLPROVIDE™（Both side tacky） CPVH Thermal conductivity 3W/m・K, low-hardness (ASKER C 15) thermal pad 2.0/3.0/4.0 2.2 15 47 Product information Catalog
CPVT COOLPROVIDE™ CPVT Ultra thin thermal sheet is suitable for minimal spaces such as in mobiles 0.1/0.15/0.2/0.25 1.4 28 - Product information Catalog
CPVP-F COOLPROVIDE™（One side tacky） CPVP-F Ultra low-hardness (ASKER C 0) thermal pad 1.0/2.0/3.0/4.0/5.0/6.0 1.4 0 - Product information Catalog
CPVP-30-F COOLPROVIDE™（One side tacky） CPVP-30-F Silicone-free, low-hardness, high thermal conductivity (3W/m・K) thermal pad 1.0/2.0/3.0/4.0 2.5 7.0 18 Product information Catalog
CPLK COOLPROVIDE™ CPLK Noise suppression thermally conductive sheet 1.0/1.5/2.0 1.4 30 60 Product information Catalog
EMPV4 COOLPROVIDE™ EMPV4 High permeability (μ'=13) thermal pad 1.0/1.5/2.0/2.5/3.0/3.5 1.4 40 70 Product information Catalog
EMPV5 COOLPROVIDE™ EMPV5 Thermal pad with noise suppression in a wide band of 500MHz-3GHz 1.0/1.5/2.0/2.5/3.0/3.5 0.8 30 60 Product information Catalog
CPSS COOLPROVIDE™（One side tacky） CPSS-F Ultra low-hardness (ASKER C 8) thermal pad 1.0/1.5/2.0/2.5/3.0/4.0 1.5 8 33 Product information Catalog
CPSS COOLPROVIDE™（Both side tacky） CPSS Ultra low-hardness (ASKER C 8) thermal pad 4.0 1.5 8 33 Product information Catalog
THERMAL DAMPER CPAG-T THERMAL DAMPER（One side adhesive attached） CPAG-T Thermal pad with vibration damping of loss factor 0.9 2.0/3.0/4.0 0.72 70 - Product information Catalog
THERMAL DAMPER THERMAL DAMPER CPAG Thermal pad with vibration damping of loss factor 0.9 1.0/2.0/3.0/4.0/5.0 0.72 70 - Product information Catalog
BONDPLY BONDPLY BP 0.13mm thick, Thermally conductive, double-sided adhesive tape (Thermal pad) 0.13 - - - Product information Catalog
CGD CHANGE GEL™（Both side tacky） CGD Phase changeable thermal pad which softens and increases in adhesive strength at 50℃ 0.25/0.5 1.88 - - Product information Catalog
CGDR CHANGE GEL™（One side tacky） CGDR Phase changeable thermal pad which softens and increases in adhesive strength at 50℃ 0.15/0.25/0.5 1.88 - - Product information Catalog
CERACOLD CERACOLD CECD Porous ceramic heat sink with excellent electrical insulation 1.5/3.0 - - - Product information Catalog
GRAPHITE HYBRID SHEET GHS-25 GRAPHITE HYBRID SHEET GHS-25 Stacked layers work together to prevent hot spots and returned heat to the device. 0.6 - - - Product information Catalog
HEAT SPREADER SHEET HEAT SPREADER SHEET HSD Thin and flexible heat spreader for thermal management at hot spots in devices 0.22/0.30 - - - Product information Catalog
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