Products & Services
Thermal Management Materials
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24 results for products.
Product | Description | Thickness(mm) | Thermal conductivity(Hot Disk method)(W / m・K) | Hardness(ASKER C) | Hardness(Shore OO) | |
---|---|---|---|---|---|---|
COOLPROVIDE™ EMPV5 | Thermal pad with noise suppression in a wide band of 500MHz-3GHz | 1.0/1.5/2.0/2.5/3.0/3.5 | 0.8 | 30 | 60 | Product information Catalog |
COOLPROVIDE™ CPVG | Putty TIM can be applied thickly with a dispenser | - | 3.0 | - | - | Product information Catalog |
COOLPROVIDE™ CPLK | Noise suppression thermally conductive sheet | 1.0/1.5/2.0 | 1.4 | 30 | 60 | Product information Catalog |
CERACOLD CECD | Porous ceramic heat sink with excellent electrical insulation | 1.5/3.0 | - | - | - | Product information Catalog |
COOLPROVIDE™ SPVS | Thermal pad with conductivity 5W/m・K, suitable for electronic devices | 0.5/1.0/1.5 | 3.4 | 70 | 86 | Product information Catalog |
COOLPROVIDE™(Both side tacky) CPSH | Thermal conductivity 5W/m・K, low-hardness (ASKER C 32) thermal pad | 1.0/1.5/2.0/2.5/3.0/3.5/4.0 | 3.7 | 32 | 64 | Product information Catalog |
COOLPROVIDE™(One side tacky) CPSH-F | Thermal conductivity 5W/m・K, low-hardness (ASKER C 32) thermal pad | 0.5/1.0/1.5/2.0/2.5/3.0/3.5/4.0 | 3.7 | 32 | 64 | Product information Catalog |
COOLPROVIDE™(Both side tacky) CPVH | Thermal conductivity 3W/m・K, low-hardness (ASKER C 15) thermal pad | 2.0/3.0/4.0 | 2.2 | 15 | 47 | Product information Catalog |
HEAT SPREADER SHEET HSD | Thin and flexible heat spreader for thermal management at hot spots in devices | 0.07/0.22/0.30 | - | - | - | Product information Catalog |
COOLPROVIDE™ SPV | Thermal pad with conductivity 3W/m・K, suitable for electronic devices | 0.5/1.0 | 2.3 | 40 | 69 | Product information Catalog |
COOLPROVIDE™(One side tacky) CPVH-F | Thermal conductivity 3W/m・K, low-hardness (ASKER C 15) thermal pad | 0.5/1.0/1.5/2.0/2.5/3.0/3.5/4.0 | 2.2 | 15 | 47 | Product information Catalog |
GAP PAD GP1 | Low-hardness and durable thermal pad, suitable for electronic devices | 0.5/1.0/1.5/2.0/2.5/3.2/4.0 | - | - | 25 | Product information Catalog |
COOLPROVIDE™ CPVT | Ultra thin thermal sheet is suitable for minimal spaces such as in mobiles | 0.1/0.15/0.2/0.25 | 1.4 | 28 | - | Product information Catalog |
SIL PAD SP | Durable and flexible thin thermal pad | 0.25 | - | - | - | Product information Catalog |
COOLPROVIDE™(One side tacky) CPVP-F | Ultra low-hardness (ASKER C 0) thermal pad | 1.0/2.0/3.0/4.0/5.0/6.0 | 1.4 | 0 | - | Product information Catalog |
COOLPROVIDE™(One side tacky) CPVP-30-F | Silicone-free, low-hardness, high thermal conductivity (3W/m・K) thermal pad | 1.0/2.0/3.0/4.0 | 3.0 | 7.0 | 18 | Product information Catalog |
COOLPROVIDE™(Both side tacky) CPSS | Ultra low-hardness (ASKER C 8) thermal pad | 4.0 | 1.5 | 8 | 33 | Product information Catalog |
COOLPROVIDE™(One side tacky) CPSS-F | Ultra low-hardness (ASKER C 8) thermal pad | 1.0/1.5/2.0/2.5/3.0/4.0 | 1.5 | 8 | 33 | Product information Catalog |
COOLPROVIDE™ EMPV4 | High permeability (μ'=13) thermal pad | 1.0/1.5/2.0/2.5/3.0/3.5 | 1.4 | 40 | 70 | Product information Catalog |
THERMAL DAMPER CPAG | Thermal pad with vibration damping of loss factor 0.9 | 1.0/2.0/3.0/4.0/5.0 | 0.72 | 70 | - | Product information Catalog |
THERMAL DAMPER(One side adhesive attached) CPAG-T | Thermal pad with vibration damping of loss factor 0.9 | 2.0/3.0/4.0 | 0.72 | 70 | - | Product information Catalog |
BONDPLY BP | 0.13mm thick, Thermally conductive, double-sided adhesive tape (Thermal pad) | 0.13 | - | - | - | Product information Catalog |
CHANGE GEL™(Both side tacky) CGD | Phase changeable thermal pad which softens and increases in adhesive strength at 50℃ | 0.25/0.5 | 1.88 | - | - | Product information Catalog |
CHANGE GEL™(One side tacky) CGDR | Phase changeable thermal pad which softens and increases in adhesive strength at 50℃ | 0.15/0.25/0.5 | 1.88 | - | - | Product information Catalog |