Thermal Management Materials
Thermal pads
Thermal pads
COOLPROVIDE™ CPVG
Feature
Useful to fill gaps between heat spreaders and ICs of various heights.
CPVG-30： GAP 1ｍｍ or less
CPVG-50： GAP 2ｍｍ or less
Putty TIM applies very low force after compression. (10% or less as compared to thermal pads)
Because the pre-crosslinked state provides structural stability,no curing process (such as heating or UV) is required and will not drip immediately after application. Applied using a manual caulking gun or an automated dispenser.
Silicone-free TIM generates no siloxane gas and has less oil bleeding.
- Silicone-free
- Highly flexible
- High thermal conductivity
- Thin type
Specification
List
| Material | Silicone-free | Feature | High flexibility, High thermal conductivity, Thin type |
|---|---|---|---|
| Color | Gray | Specific gravity | 2.9 |
| Volume resistivity(Ω・cm) | 1.0×10[[sup:9]] | Tracking resistance test CTI(V) | - |
| Hardness(ASKER C) | - | Hardness(Shore OO) | - |
| Hardness(Shore A) | - | Thermal conductivity(Hot wire method)(W / m・K) | 3.0 |
| Thermal conductivity(Hot Disk method)(W / m・K) | 3.0 | Phase change temperature(℃) | - |
| Permeability(μ') | - | Maximum effective dimensions(mm) | Cartridge:330ml |
Different part number may have different characteristics. Please refer to the catalog for details.
Please refer to the catalog for thermal conductivity standards.
The thermal pad can be layered to make it thicker.
Part No. list
You can download a drawing and a test report,
add an sample to Sample Request Box per part number.
| Part No. | Thickness (mm) |
L1 (mm) |
L2 (mm) |
Flame retardance (UL) |
Drawings/3D Data/Certs | Sample Request |
|---|---|---|---|---|---|---|
| CPVG-30-C | 1.0 | - | - | - | ||
| CPVG-50-P | 2.0 | - | - | - |
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