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Thermal Management Materials

Thermal Resistance Simulation Software for Thermal Pads

By following the three steps in the attached figure you can determine the "combined thermal resistance" and "IC temperature rise".

STEP 1.IC setup (heating element)

IC (heating element)
IC package model number (mold resin size)

If your IC package is not in the list, enter the thermal resistance directly.
Thermal resistance (φjt) between a chip and a package* ℃/W

Enter a value between 1.00–99
Calorific value* W

Enter a value between 1.00–99

STEP 2.Setup of Heat sink

Heat sink
Heat sink

If your heatsink is not in the list, enter the thermal resistance directly.
Heat resistance​* ℃/W

Enter a value between 1.00–99
Fan orientation

Upward
Please contact us if it is not upward

STEP 3.Setup of Thermal conductive sheet

GAP dimension
Thermal conductive sheet

*When the simulation is for a thermal pad, use a thermal pad thicker than the GAP dimension.

Thermal conductive sheet*

Select a thermal conductive sheet to be used.

Thermal conductivity W/m･K
GAP dimension( t ) * mm

Enter a value between 0.10–99
Width ( W ) * mm

Enter a value between 1.00–99
Length ( L ) * mm

Enter a value between 1.00–99

Fields marked with * are required to be entered.

Calculation result

Synthetic heat resistance

-

℃/W

IC temperature rise value

-

℃

The result is based on a simple simulation.
We can create detailed simulation according to various conditions,
please contact us for details.

Click here for inquiries

Applicable Thermal pads

CGDR

CHANGE GEL™（One side tacky） CGDR

Phase changeable thermal pad which softens and increases in adhesive strength at 50℃

Product information
THERMAL DAMPER

THERMAL DAMPER CPAG

Thermal pad with vibration damping of loss factor 0.9

Product information
CPSH-F

COOLPROVIDE™（One side tacky） CPSH-F

Thermal conductivity 5W/m・K, low-hardness (ASKER C 32) thermal pad

Product information
CPSS

COOLPROVIDE™（One side tacky） CPSS-F

Ultra low-hardness (ASKER C 8) thermal pad

Product information
CPVH-F

COOLPROVIDE™（One side tacky） CPVH-F

Thermal conductivity 3W/m・K, low-hardness (ASKER C 15) thermal pad

Product information
CPVP-F

COOLPROVIDE™（One side tacky） CPVP-F

Ultra low-hardness (ASKER C 0) thermal pad

Product information
CPVP-30-F

COOLPROVIDE™（One side tacky） CPVP-30-F

Silicone-free, low-hardness, high thermal conductivity (3W/m・K) thermal pad

Product information
CPVT

COOLPROVIDE™ CPVT

Ultra thin thermal sheet is suitable for minimal spaces such as in mobiles

Product information
EMPV4

COOLPROVIDE™ EMPV4

High permeability (μ'=13) thermal pad

Product information
EMPV5

COOLPROVIDE™ EMPV5

Thermal pad with noise suppression in a wide band of 500MHz-3GHz

Product information
SPV

COOLPROVIDE™ SPV

Thermal pad with conductivity 3W/m・K, suitable for electronic devices

Product information
SPVS

COOLPROVIDE™ SPVS

Thermal pad with conductivity 5W/m・K, suitable for electronic devices

Product information