Thermal Management Materials

Thermal pads

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Thermal pads

COOLPROVIDE™ CPLK

Silicone-free type

Feature

Noise level is lowered at low-frequencies compared with conventional thermally conductive sheets.
Low-dielectric thermally conductive sheet helps to reduce noise in GHz bands, which occurs by heat sink’s resonance phenomena.
Silicone-free type generates no siloxane gas and oil bleeding is reduced.

  • Thermal pad
  • Silicone-free
  • EM wave suppression
  • One side tacky

Materials

Acrylic resin

Specification

List

Material Silicone-free Feature EM wave suppression, One side tacky
Color Mauve Specific gravity 2.0
Volume resistivity(Ω・cm) 1.0×10[[sup:11]] Tracking resistance test CTI(V) -
Hardness(ASKER C) 30 Hardness(Shore OO) 60
Hardness(Shore A) - Thermal conductivity(Hot wire method)(W / m・K) 2.0
Thermal conductivity(Hot Disk method)(W / m・K) 1.4 Phase change temperature(℃) -
Permeability(μ') - Maximum effective dimensions(mm) 200×500

Different part number may have different characteristics. Please refer to the catalog for details.

Please refer to the catalog for thermal conductivity standards.
The thermal pad can be layered to make it thicker.

Product Dimensions

 

Part No. list

You can download a drawing and a test report,
add an sample to Sample Request Box per part number.

Part No. Thickness(mm) L1(mm) L2(mm) Flame retardance(UL) Download Data Sample Request
CPLK-1.0F 1.0 - - V-0 equivalent Please ask
CPLK-1.5F 1.5 - - V-0 equivalent Please ask
CPLK-2.0F 2.0 - - V-0 equivalent Please ask

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