Thermal Management Materials

Thermal pads

View Comparison

Thermal pads

GAP PAD GP1

Silicone type

Feature

Reinforced layer enables both flexibility and durability.
Low-hardness pad of Shore 00 25 fills gaps to lower heat resistance.
With excellent stress-relaxation, the pad places little load on heating elements and PCBs after assembly.
Operating temperature range is from -40℃ to 150℃.
Suitable for managing heat issues of electronics
【Company Name : HENKEL CORPORATION】

  • Thermal pad
  • Silicone
  • Highly flexible
  • One side tacky
  • UL rated available

Materials

Silicone

Specification

List

Material Silicone Feature Highly flexible, One side tacky, UL rated available
Color Pink/Mauve (2 layers) Specific gravity -
Volume resistivity(Ω・cm) 5.0×10[[sup:12]] Tracking resistance test CTI(V) -
Hardness(ASKER C) - Hardness(Shore OO) 25
Hardness(Shore A) - Thermal conductivity(Hot wire method)(W / m・K) 0.8
Thermal conductivity(Hot Disk method)(W / m・K) - Phase change temperature(℃) -
Permeability(μ') - Maximum effective dimensions(mm) 190×390

Different part number may have different characteristics. Please refer to the catalog for details.

Please refer to the catalog for thermal conductivity standards.
The thermal pad can be layered to make it thicker.

Product Dimensions

GP1

Part No. list

You can download a drawing and a test report,
add an sample to Sample Request Box per part number.

Part No. Thickness(mm) L1(mm) L2(mm) Flame retardance(UL) Download Data Sample Request
GP1-0.5 0.5 200 400 94 V-0
GP1-1.0 1.0 200 400 94 V-0
GP1-1.5 1.5 200 400 94 V-0
GP1-2.0 2.0 200 400 94 V-0
GP1-2.5 2.5 200 400 94 V-0 Please ask
GP1-3.2 3.2 200 400 94 V-0
GP1-4.0 4.0 200 400 94 V-0 Please ask

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