Thermal Management Materials

Thermal pads

View Comparison

Thermal pads

GAP PAD GP1

Silicone type

Feature

Reinforced layer enables both flexibility and durability.
Low-hardness pad of Shore 00 25 fills gaps to lower heat resistance.
With excellent stress-relaxation, the pad places little load on heating elements and PCBs after assembly.
Operating temperature range is from -40℃ to 150℃.
Suitable for managing heat issues of electronics
【Company Name : HENKEL CORPORATION】

  • Thermal pad
  • Silicone
  • Highly flexible
  • One side tacky
  • UL rated available

Materials

Silicone

Specification

List

Material Silicone Feature Highly flexible, One side tacky, UL rated available
Color Pink/Mauve (2 layers) Specific gravity -
Volume resistivity(Ω・cm) 5.0×10[[sup:12]] Adhesive strenght(N / 25mm) -
Hardness(ASKER C) - Hardness(Shore OO) 25
Hardness(Shore A) - Thermal conductivity(Hot wire method)(W / m・K) 0.8
Thermal conductivity(Hot Disk method)(W / m・K) - Phase change temperature(℃) -
Permeability(μ') - Standard length(mm) 190×390

Product Dimensions

GP1

Part No. list

You can download a drawing and a test report,
add an sample to Sample Request Box per part number.

Part No. Thickness(mm) L1(mm) L2(mm) Flame retardance(UL) Download Data Sample Request
GP1-0.5 0.5 200 400 94 V-0
GP1-1.0 1.0 200 400 94 V-0
GP1-1.5 1.5 200 400 94 V-0
GP1-2.0 2.0 200 400 94 V-0
GP1-2.5 2.5 200 400 94 V-0 Please ask
GP1-3.2 3.2 200 400 94 V-0
GP1-4.0 4.0 200 400 94 V-0 Please ask

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