Thermal Management Materials

Thermal pads

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Thermal pads

COOLPROVIDE™(One side tacky) CPVP-30-F

Silicone-free type


Super compliable (ASKER C 0) material minimizes thermal resistance.
Compliable thermal pad with excellent compressive stress relaxation that reduces the load to heat element and PCB.
* 1.0, 1.5 and 2.0mm thick products are under development.
Layered design for easy handling.
Silicone-free, no siloxane outgassing.
Oil bleeding is reduced compared to silicone-based thermal materials.

  • Silicone-free
  • High thermal conductivity
  • High flexibility
  • One side tacky


Acrylic resin



Material Silicone-free Feature Silicone-free, High thermal conductivity, High flexibility, One side tacky
Color Green/White Specific gravity -
Volume resistivity(Ω・cm) 1.0×10[[sup:11]] Adhesive strenght(N / 25mm) -
Hardness(ASKER C) 7.0 Hardness(Shore OO) 18
Hardness(Shore A) - Thermal conductivity(Hot wire method)(W / m・K) 3.0
Thermal conductivity(Hot Disk method)(W / m・K) 3.0 Phase change temperature(℃) -
Permeability(μ') - Standard length(mm) 200×500

Product Dimensions


Part No. list

You can download a drawing and a test report,
add an sample to Sample Request Box per part number.

Part No. Thickness(mm) L1(mm) L2(mm) Flame retardance(UL) Download Data Sample Request
CPVP-30-1.0F 1.0 - - Please ask
Please ask
CPVP-30-1.5F 1.5 - - Please ask
Please ask
CPVP-30-2.0F 2.0 - - Please ask
Please ask
CPVP-30-3.0F 3.0 - - 94 V-0相当 Please ask
CPVP-30-4.0F 4.0 - - 94 V-0相当 Please ask

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