Products & Services
Sputtering
Sputtering technique
Sputtering is a technique for forming high-quality thin films
Sputtering is a kind of dry plating. A target of the thin-film forming (deposition) material and a substrate as an anode are placed in a vacuum chamber filled with inert gas (Ar gas etc.). A high voltage is applied between them.
The high voltage generates plasma and in the plasma, Ar+ collides with the target at high speed. The target particles which have been sputtered, adhere to the substrate, leading to film formation.
• The attachment energy of the deposition material is so high that it can form a film with high adhesion strength.
• Precision film thickness control is possible, resulting in a thin film with excellent density and uniformity.
• Sputtering can form a metal film with a high melting point, which is difficult by vapor deposition, and also can form a film without changing the composition of the alloy.
• Single-element metals, alloy materials, oxides, nitrides, etc. can be formed on the surface of films, resin molded products, metals, glasses, etc. with a nanoorder thickness.
Difference between Sputtering and Vapor deposition
| Deposition method | |
|---|---|
| Sputtering | By hitting argon ions against thin-film forming (deposition) metal, metal oxide, etc., the fine particles which have been sputtered adhere to the substrate and deposit on the surface. |
| Vapor deposition |
| Film adhesion | Thin film density | Alloy deposition | Deposition on heat-sensitive substrates | Deposition rate | |
|---|---|---|---|---|---|
| Sputtering | ◎ | ◎ | ◎ | ◎ | △ |
| Vapor deposition | ○ | ○ | △ | △ | ○ |
Deposition Materials and Functions
| Classification | Materials | Functions |
|---|---|---|
| Metal | SUS | Corrosion resistance, antibacterial, decorative, antistatic |
| Cu, Cu alloy | Conductive, electromagnetic shielding, antibacterial | |
| Ti | Heat retention and shielding | |
| Ag alloy | Ray reflection film, electromagnetic wave shield | |
| Cr | Corrosion resistance | |
| Metal Oxide | SiO2 | Gas barrier film, insulating film |
| ITO | Transparent conductivity | |
| TiO2 | Photocatalyst, hydrophilic | |
| Carbon | Graphite | Highly thermally conductive, conductive |
| DLC | Sliding properties, high hardness, gas adsorption | |
| Laminated films | High-refractive index material/Ag alloy/High-refractive index material | Heat ray reflection, thermal insulation |
| Low-refractive index material/High-refractive index material/Low refractive index material etc. | Anti-reflective film | |
| SiO2/ITO | Transparent electrode |
Substrate Materials
| Substrate | Materials |
|---|---|
| Resin | PET、PC、PA、PPS、PMMA、PI、PE、PEN、ABS |
| Other | Glass, ceramics |
Prototyping and Mass production of Functional Films
• A wide range of base material widths up to 1600 mm are available.
• Our plant is equipped for prototyping, small lots and mass production, capable of deposition length up to 2500 m (t:125 μm).
Prototype Deposition on 3D molded products, Glass, etc., and Mass Production
• Base materials up to 1 m × 2 m are available.
• Please contact us for special cases, such as film formation on non-flat surfaces, side faces of base materials, curved surfaces and protruding objects.