Products & ServicesThermal Management Materials Simple Simulations for Thermal Conductivity STEP 1.IC setup (heating element) IC package model number (mold resin size) QFP32(width 7.0mm × length 7.0mm) QFP64-H1(width 10.0mm × length 10.0mm) QFP100-U1(width 20.0mm × length 14.0mm) SOP8(width 5.0mm × length 4.0mm) SOP22(width 13.6mm× length 5.4mm) LQFP64-H2(width 10.0mm × length 10.0mm) If your IC package is not in the list, enter the thermal resistance directly. Thermal resistance (φjt) between a chip and a package* ℃/W Enter a value between 1.00–99 Calorific value* W Enter a value between 1.00–99 STEP 2.Setup of Thermal conductive sheet Thermal conductive sheet CGDR(1.88Wm・K/Silicone free/Heat resistance: 110℃/Phase-change) CPAG(0.72Wm・K/Silicone free/Heat resistance: 110℃/Vibration suppression) CPSH-F(3.7Wm・K/Silicone free/UL94V-0/Heat resistance: 125℃) CPSS-F(1.5Wm・K/Silicone free/UL94V-0/Heat resistance: 110℃/Low hardness) CPVH-F(2.2Wm・K/Silicone free/UL94V-0/Heat resistance: 125℃) CPVP-F(1.4Wm・K/Silicone free/UL94V-0/Heat resistance: 125℃/Super low hardness) CPVP-30-F(3.0Wm・K/Silicone free/UL94V-0/Heat resistance: 125℃) CPVT-F(1.4Wm・K/Silicone free/Heat resistance: 110℃/Thin film sheet) EMPV4-F(1.4Wm・K/Silicone free/Heat resistance: 110℃/Noise suppression) EMPV5-F(0.8Wm・K/Silicone free/Heat resistance: 110℃/Noise suppression) SPV(2.3Wm・K/Silicone/UL94V-1/Heat resistance: 150℃) SPVS(3.4Wm・K/Silicone/UL94V-0/Heat resistance: 150℃) Select a thermal conductive sheet to be used. Or you can directly enter the thermal conductivity. Thermal conductivity* W/m・℃ Enter a value between 1.00–99 Thickness( t ) * mm Enter a value between 1.00–99 Width ( W ) * mm Enter a value between 1.00–99 Length ( L ) * mm Enter a value between 1.00–99 STEP 3.Setup of Heat sink Heat sink 50×32×Height 12(base 3)7 fins, pitch 5(mm) 50×40×Height 20(base 5)6 fins, pitch 7.5(mm) 50×50×Height 30(base 5)7 fins, pitch 8(mm) Aluminum plate100 x 100 x Thickness1(mm) Aluminum plate100 x 100 x Thickness2(mm) Iron plate 100 x 100 x Thickness1(mm) Iron plate 100 x 100 x Thickness2(mm) If your heatsink is not in the list, enter the thermal resistance directly. Heat resistance* ℃/W Enter a value between 1.00–99 Fan orientation Upward Please contact us if it is not upward Fields marked with * are required to be entered. Calculation result Synthetic heat resistance - ℃/W IC temperature rise value - ℃ The result is based on a simple simulation. We can create detailed simulation according to various conditions, please contact us for details. Click here for inquiries Applicable Thermal pads CHANGE GEL™(One side tacky) CGDR Phase changeable thermal pad which softens and increases in adhesive strength at 50℃ Product information THERMAL DAMPER CPAG Thermal pad with vibration damping of loss factor 0.9 Product information COOLPROVIDE™(One side tacky) CPSH-F Thermal conductivity 5W/m・K, low-hardness (ASKER C 32) thermal pad Product information COOLPROVIDE™(One side tacky) CPSS-F Ultra low-hardness (ASKER C 8) thermal pad Product information COOLPROVIDE™(One side tacky) CPVH-F Thermal conductivity 3W/m・K, low-hardness (ASKER C 15) thermal pad Product information COOLPROVIDE™(One side tacky) CPVP-F Ultra low-hardness (ASKER C 0) thermal pad Product information COOLPROVIDE™(One side tacky) CPVP-30-F Silicone-free, low-hardness, high thermal conductivity (3W/m・K) thermal pad Product information COOLPROVIDE™ CPVT Ultra thin thermal sheet is suitable for minimal spaces such as in mobiles Product information COOLPROVIDE™ EMPV4 High permeability (μ'=13) thermal pad Product information COOLPROVIDE™ EMPV5 Thermal pad with noise suppression in a wide band of 500MHz-3GHz Product information COOLPROVIDE™ SPV Thermal pad with conductivity 3W/m・K, suitable for electronic devices Product information COOLPROVIDE™ SPVS Thermal pad with conductivity 5W/m・K, suitable for electronic devices Product information