Thermal Management Materials

Thermal pads

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Thermal pads

HEAT SPREADER SHEET HSD

Silicone-free type

Feature

The aluminum heat spreader has an excellent thermal conductivity (221W/m•K), which dissipates heat in the in-plane direction.
Flexible material is suitable for curved surfaces and various thicknesses are available.
Optional electrically insulating layer (PET films, thermal pads) can be applied upon request.
Ideal thermal solutions for hot spots, such as mobile devices, tablets, routers etc.

  • Thermal pad
  • Silicone-free
  • High thermal conductivity
  • One side tacky
  • Thin type
  • Heat dissipation material

Materials

Aluminum foil
Thermally conductive adhesive layer

Specification

List

Material Silicone-free Feature Silicone-free, One side tacky, Available for UL, Thin type
Color - Specific gravity -
Volume resistivity(Ω・cm) - Adhesive strenght(N / 25mm) >6
Hardness(ASKER C) - Hardness(Shore OO) -
Hardness(Shore A) - Thermal conductivity(Hot wire method)(W / m・K) 221
Thermal conductivity(Hot Disk method)(W / m・K) - Phase change temperature(℃) -
Permeability(μ') - Standard length(mm) -

Product Dimensions

HSD

Part No. list

You can download a drawing and a test report,
add an sample to Sample Request Box per part number.

Part No. Thickness(mm) L1(mm) L2(mm) Flame retardance(UL) Download Data Sample Request
HSD-0.07 0.07 210 300 510 equivalent
HSD-0.15 0.22 210 500 94 VTM-0相当
Please ask
HSD-0.25 0.30 210 500 94 VTM-0相当
Please ask

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Suggestion of selection guide of expected Thermal Interface Product is also available.

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