Thermal Management Materials

Thermal pads

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Thermal pads

COOLPROVIDE™ CPVG

Silicone-free type

Feature

Putty TIM does not drip even when coated thickly.
Useful to fill gaps between heat spreaders and ICs of various heights
Putty type TIM has low repulsive force (after compression) and load on ICs and PCBs is lowered to 10 % or less compared to the sheet type.
Single liquid type, cross-linked material scarcely drips.
Auto coating is possible with a dispenser.
Silicone free material generates no siloxane outgassing and hardly bleeds oil.

  • Silicone-free
  • Highly flexible
  • High thermal conductivity
  • Thin type

Specification

List

Material Silicone-free Feature High flexibility, High thermal conductivity, Thin type
Color Gray Specific gravity 2.9
Volume resistivity(Ω・cm) 1.0×10[[sup:9]] Tracking resistance test CTI(V) -
Hardness(ASKER C) - Hardness(Shore OO) -
Hardness(Shore A) - Thermal conductivity(Hot wire method)(W / m・K) 3.0
Thermal conductivity(Hot Disk method)(W / m・K) 3.0 Phase change temperature(℃) -
Permeability(μ') - Maximum effective dimensions(mm) Cartridge:330ml

Different part number may have different characteristics. Please refer to the catalog for details.

Please refer to the catalog for thermal conductivity standards.
The thermal pad can be layered to make it thicker.

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