Thermal Management Materials

Thermal pads

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Thermal pads


Silicone-free type


Putty TIM does not drip even when coated thickly.
Useful to fill gaps between heat spreaders and ICs of various heights
Putty type TIM has low repulsive force (after compression) and load on ICs and PCBs is lowered to 10 % or less compared to the sheet type.
Single liquid type, cross-linked material scarcely drips.
Auto coating is possible with a dispenser.
Silicone free material generates no siloxane outgassing and hardly bleeds oil.

  • Silicone-free
  • Highly flexible
  • High thermal conductivity
  • Thin type



Material Silicone-free Feature High flexibility, High thermal conductivity, Thin type
Color Gray Specific gravity 2.9
Volume resistivity(Ω・cm) 1.0×10[[sup:9]] Adhesive strenght(N / 25mm) -
Hardness(ASKER C) - Hardness(Shore OO) -
Hardness(Shore A) - Thermal conductivity(Hot wire method)(W / m・K) 3.0
Thermal conductivity(Hot Disk method)(W / m・K) 3.0 Phase change temperature(℃) -
Permeability(μ') - Standard length(mm) Cartridge:330ml

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