Thermal Management Materials

Thermal pads

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Thermal pads

THERMAL DAMPER CPAG

Silicone-free type

Feature

Dual functions provided, thermally conductive and vibration damping
Excellent vibration control of loss factor 0.9
Custom profiles can be provided upon request.
Uses silicone free material, no siloxane outgassing

  • Thermal pad
  • Silicone-free
  • Thin type
  • Vibration damping
  • Heat dissipation
  • UL rated available

Materials

ACM

Specification

List

Material Non-silicon Feature High thermal conductivity, Vibration damping
Color Gray Specific gravity 1.67
Volume resistivity(Ω・cm) 5.5×10[[sup:11]] Adhesive strenght(N / 25mm) -
Hardness(ASKER C) 70 Hardness(Shore OO) -
Hardness(Shore A) - Thermal conductivity(Hot wire method)(W / m・K) 0.8
Thermal conductivity(Hot Disk method)(W / m・K) 0.72 Phase change temperature(℃) -
Permeability(μ') - Standard length(mm) 345×345

Product Dimensions

CPAG

Part No. list

You can download a drawing and a test report,
add an sample to Sample Request Box per part number.

Part No. Thickness(mm) L1(mm) L2(mm) Flame retardance(UL) Download Data Sample Request
CPAG-1.0 1.0 355 355 -
CPAG-2.0 2.0 355 355 -
CPAG-3.0 3.0 355 355 -
CPAG-4.0 4.0 355 355 -
CPAG-5.0 5.0 355 355 -

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