Thermal Management Materials

Thermal pads

View Comparison

Thermal pads


Silicone-free type


Dual functions provided, thermally conductive and vibration damping
Excellent vibration control of loss factor 0.9
Custom profiles can be provided upon request.
Uses silicone free material, no siloxane outgassing

  • Thermal pad
  • Silicone-free
  • Thin type
  • Vibration damping
  • Heat dissipation
  • UL rated available





Material Non-silicon Feature High thermal conductivity, Vibration damping
Color Gray Specific gravity 1.67
Volume resistivity(Ω・cm) 5.5×10[[sup:11]] Adhesive strenght(N / 25mm) -
Hardness(ASKER C) 70 Hardness(Shore OO) -
Hardness(Shore A) - Thermal conductivity(Hot wire method)(W / m・K) 0.8
Thermal conductivity(Hot Disk method)(W / m・K) 0.72 Phase change temperature(℃) -
Permeability(μ') - Standard length(mm) 345×345

Product Dimensions


Part No. list

You can download a drawing and a test report,
add an sample to Sample Request Box per part number.

Part No. Thickness(mm) L1(mm) L2(mm) Flame retardance(UL) Download Data Sample Request
CPAG-1.0 1.0 355 355 -
CPAG-2.0 2.0 355 355 -
CPAG-3.0 3.0 355 355 -
CPAG-4.0 4.0 355 355 -
CPAG-5.0 5.0 355 355 -

Product Inquiry

Please send us your inquiry from the query system regarding product and technical matter about it.
Suggestion of selection guide of expected Thermal Interface Product is also available.

If you are a website member, you can easily ask inquiry after Login.